Uniform Lithographic Coating
Nanofilm provides high-uniformity photoresist application utilizing industry-standard AZ chemistry. Our precision spin-coating technology ensures a consistent, defect-free layer across the entire clear aperture of the substrate.
Edge-Bead Removal: Specialized processing ensures clean edges for better mechanical fit and reduced particulate risk during exposure.
Customizable Profiles: While our standard baseline is 5,300Å, we offer fully customizable thickness profiles to match your specific exposure energy and etch-resistance requirements.
Ready-to-Expose: All resist-coated blanks are delivered in light-tight, UV-protected packaging, ensuring they arrive at your facility ready for immediate placement in your aligner or stepper.